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James L. Drewniak is a Curator’s Professor of Electrical and Computer Engineering at Missouri S&T. He received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign. His research is in electromagnetic compatibility, signal and power integrity, and electronic packaging. He is with the Missouri Electromagnetic Compatibility Laboratory, a university research laboratory of approximately 70 people that is internationally recognized for research in EMC and signal and power integrity. A key component of the research sponsorship is the National Science Foundation Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility that is a consortium of over 20 companies. He is a Fellow of the IEEE, 2013 recipient of the IEEE EMC Society’s Richard R. Stoddart Award, and a past Associate Editor of the IEEE Transactions on EMC.
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.105-108, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.94-99, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.249-254, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.100-104, (2023)
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.70-73, (2023)
IEEE Transactions on Antennas and Propagationno. 8 (2023): 6707-6716
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)pp.244-249, (2022)
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)pp.460-464, (2022)
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