基本信息
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个人简介
Jin-Wook Jang received the M.S. and Ph.D. degrees in materials science and engineering from Seoul National University, Seoul, South Korea, in 1992 and 1996, respectively.
He then joined the University of California, Los Angeles, as a Post-Doctoral Research Associate from 1997 through 1999, where he studied the physical metallurgy of solder science for flip chip packaging. In 1999, he joined Motorola, Inc., Tempe, AZ, as an Electronic Packaging Engineer. For his first year at Motorola, his research was devoted to the characterization of lead-free solder and UBM materials for the flip chip. Currently, he is involved in the R&D of RF power packaging products of Motorola. His main responsibility is the characterization and failure analysis for a variety of RF power packaging products.
研究兴趣
论文共 254 篇作者统计合作学者相似作者
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EUROPEAN JOURNAL OF NUCLEAR MEDICINE AND MOLECULAR IMAGINGno. SUPPL 1 (2023): S504-S504
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Korean Association for Adult and Continuing Educationno. 2 (2022): 1-25
E. Bedford,V. Russo, C. Dickman, B. Li,A. Jezierski,D. Kim,J. Jang, Y. Yin,D.A. Harrington, R. Sharma, L. De la Vega, S. Willerth,
E. Bedford,V. Russo, C. Dickman, B. Li,A. Jezierski,D. Kim,J. Jang, Y. Yin,D. A. Harrington, R. Sharma, L. De la Vega, S. Willerth,
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Journal of Computational Fluids Engineeringno. 2 (2021): 62-68
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作者统计
#Papers: 254
#Citation: 6120
H-Index: 34
G-Index: 72
Sociability: 7
Diversity: 3
Activity: 6
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