基本信息
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Bio
Prof Jingshen Wu graduated with a prestigious Guo Mo-Ruo Prize/Silver Medal from the University of Science and Technology of China (USTC) in 1983. After working in the Chinese Academy of Sciences and Xi'an Jiaotong University for four years, he was invited to work in the Polymer and Composites Group at the Technical University of Hamburg-Harburg (TUHH), Germany from July 1987 to December 1989. His major research interests at TUHH included the fracture behavior of fiber reinforced polymer composites under impact loading and friction and wear properties of polymers and polymer composites at elevated temperatures. In December 1989, Prof Wu started his postgraduate study in the area of polymer blends at the University of Sydney, Australia. As part of his PhD program, Prof Wu also studied at the University of Michigan, Ann Arbor, USA from 1991 to 1992. In March 1994, he was awarded his PhD degree and subsequently, was appointed as a postdoctoral research associate by the University of Sydney. In January 1995, he was awarded a prominent Australian Postdoctoral Research Fellowship. Prof Wu joined the Department of Mechanical and Aerospace Engineering of the Hong Kong University of Science and Technology in early 1996. He is a professor and the director of the Center for Engineering Materials and Reliability (CEMAR) and the director of the Advanced Engineering Facility (AEMF); He has been appointed as an Adjunct Professor by the University of Science and Technology of China (USTC); Xi'an Jiaotong University; Sichuan University and Harbin Engineering University.
Departmental Research Area
Advanced Materials & Technology, Aircraft & Aeronautical Engineering, Environmental Engineering: Environmental Sustainability, Nano Technology, Electronic Packaging
Individual Research Interest
Prof Jingshen Wu’s major research interests are to study (1) the processing-morphology-property relationships of polymer and polymer composites/nanocomposite; (2) the fracture and toughening mechanisms of engineering materials and (3) characterization and failure mechanisms of microelectronic packaging materials and failure analysis of IC packages. Recently, he has studied polymerization, processing condition, microstructure formation and properties of epoxy/clay, epoxy/nanotubes and other polymer-based nanocomposites systematically. Through this research, he and his group developed unique techniques for nanoparticle dispersion and distribution in viscous polymer matrices, examined the nano-structure of various polymer nanocomposites thoroughly and disclosed new fracture/toughening mechanisms associated in the fracture processes of polymer nanocomposites.
Research Interests
Papers共 182 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1827-1833, (2022)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2022)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.402-407, (2021)
international conference on electronic packaging technologypp.1-5, (2021)
international conference on electronic packaging technologypp.1-6, (2021)
international conference on electronic packaging technologypp.1-5, (2021)
international conference on electronic packaging technologypp.1-5, (2021)
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