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Research Interests

Papers共 18 篇Author StatisticsCo-AuthorSimilar Experts

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A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind
Roland Mumford,Janet Hopkins,Owen Guy
IEEE Transactions on Semiconductor Manufacturingno. 2 (2023): 188-196
Cited0Views0EIWOSBibtex
0
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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment
Harry Fulton,Oliver Ansell,Janet Hopkins, Martin Hanicinec, Takuo Nishida,Taku Umemoto,Lijie Li
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2020): 694-703
Cited0Views0EIWOSBibtex
0
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Improved Semiconductor Device Reliability from Plasma Dicing
R. Barnett,Janet Hopkins, Stewart Fulton,Oliver Ansell, Samira Kazemi,Matthew Day
2019 International Wafer Level Packaging Conference (IWLPC)pp.1-7, (2019)
Cited1Views0EIWOSBibtex
1
0
(Invited) Deep Silicon Etching Increasingly Relevant >20 Years on
Dave Thomas, Matthew Muggeridge,Janet Hopkins, Nicolas Launay,Huma Ashraf, Tony Barrass
ECS Meeting Abstractsno. 18 (2016): 1071-1071
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