Jeffrey A. Zitz - IBM Systems and Technology Group, Hopewell Junction

基本信息

Career Trajectory

Bio

Jeffrey A. Zitz IBM Systems, Hopewell Junction, NY 12533 USA (jeffzitz@us.ibm.com). Mr. Zitz is the Packaging Team Leader for the development and qualification of advanced processors for IBM's highly successful zSystems family of servers. He received B.S.M.E. and M.S.M.E. degrees from Rensselaer Polytechnic Institute and is a Professional Engineer in the State of New York.

Research Interests

Papers共 39 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选

IBM Z14: Enabling Physical Design in 14-Nm Technology for High-Performance, High-Reliability Microprocessors

D. Wolpert,E. Behnen,L. Sigal,Y. Chan,G. E. Tellez, D. Bradley,R. Serton, R. Veerabhadraiah, W. Ansley, A. Bianchi,N. Dhanwada,S. Lee,M. Scheuermann,G. Wiedemeier, J. Davis,T. Werner,L. Darden,K. Barkley, M. Gray,M. Guzowski, M. DeHond, T. Schell, S. Tsapepas,D. Phan, K. Acharya,J. A. Zitz,H. F. Shi,C. Berry,J. Warnock,M. H. Wood,R. M. Averill

IBM JOURNAL OF RESEARCH AND DEVELOPMENT（2018）

Cited7Views0EIWOSBibtex

A Systematic Experimental Investigation of Thermal Degradation Mechanisms in Lidded Flip-Chip Packages: Effects of Thermal Aging and Cyclic Loading

Tuhin Sinha,Jeffrey A. Zitz

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems（2017）

Cited1Views0EIWOSBibtex

Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling

X. Wei, A. VandeVenter, S. Canfield,Y. Yu, J. Torok, P. Kelly, D. Porter, W. Kostenko,J. Zitz,K. Sikka

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Syste...（2016）

Cited6Views0EIWOSBibtex

Electronic assembly with detachable coolant manifold and coolant-cooled electronic module

Thomas Brunschwiler,Evan G Colgan,Michael J Ellsworth,Werner Escher,Ingmar Meijer,Stephan Paredes,Gerd Schlottig, Martin Witzig,Jeffrey A Zitz

mag（2015）

Cited24Views0Bibtex

J Warnock 22nm Next-Generation IBM System Z Microprocessor ISSCC 2015 Slidedeck

J.D. Warnock,Brian Curran,John Badar,Gregory Fredeman,D. Plass, Ya-chih Chan,Seán Carey, G. Salem, F. Schroeder,F. Malgioglio,G. Mayer,Christopher Berry, David de Oca Zapiain,Yiu-Hing Chan, Maria Mayo,John Isakson, Chandrashekhar Nagarajan, T. Werner,L. Sigal,Ricardo Nigaglioni,Mark Cichanowski,Jeffrey A. Zitz, M. Ziegler, T. Bronson, G. Strevig, Dan Dreps,Ruchir Puri, Daniel G. Malone,D. Wendel, P. Mak, Mike Blake

openalex（2015）

Cited0Views0Bibtex

22nm Next-Generation Ibm System Z Microprocessor

2015 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC) (2015): 70-U90

Cited4Views0Bibtex

NON-HERMETIC SEALED MULTI-CHIP MODULE PACKAGE

Paul F Bodenweber,Hilton T Toy,Krishna R Tunga,Jeffrey A Zitz

mag（2014）

Cited23Views0Bibtex

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