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Bio
Jang-Hi Im (SM'04) received the B.S. degree in mechanical
engineering from Seoul National University, Seoul, South Korea, in 1964 and the M.S. degree in mechanical engineering
and the Ph.D. degree in materials science and engineering from Massachusetts Institute of Technology, Cambridge, MA,
USA, in 1971 and 1976, respectively.
Up until 2004, he was with The Dow Chemical Company for 28 years, taking on various R&D positions, including
Research Scientist in electronic materials. In this last capacity, he had headed materials science and adhesion efforts
for Benzocyclobutene and SiLK dielectrics. He is currently a Research Professor with the Laboratory for Interconnect
and Packaging, The University of Texas, Austin, TX, USA. He has over 100 published papers and is the holder of nine
U.S. patents.
Research Interests
Papers共 79 篇Author StatisticsCo-AuthorSimilar Experts
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International Symposium on Microelectronicsno. 1 (2015): 000008-000012
semanticscholar(2014)
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Encyclopedia of Thermal Stressespp.5208-5217, (2014)
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