基本信息
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Career Trajectory
Bio
Hyungjun Kim (Member, IEEE) received the B.S. and M.S. degrees from the Department of Inorganic Materials, Seoul National University, Seoul, South Korea, in 1990 and 1992, respectively, and the Ph.D. degree in materials science and engineering from the University of Illinois at Urbana-Champaign, Champaign, IL, USA, in 1998.
He is a Professor with the School of Electrical and Electronic Engineering, Yonsei University, Seoul. He is also the Director of the Air Liquide-Yonsei Joint Research Center (ALYC), Yonsei University. Before he joined the Faculty of Yonsei University in 2009, he was a Faculty with the Department of Materials Science and Engineering, Pohang University of Science and Technology (Postech), Pohang, South Korea, from 2004 to 2009; and a Research Staff Member with the Department of Silicon Technology, IBM Research Division, Yorktown Heights, NY, USA, from 2000 to 2004. He pioneered plasma-enhanced ALD (PE-ALD) of metals and nitrides for Cu interconnect technologies and explored various thin-film processes for CMOS and novel nanodevices fabrication. Prior to joining IBM Research in 2000, he was a Visiting Research Professor with the University of Illinois at Urbana-Champaign, where he carried out research in the surface chemistry and growth of thin layers of silicon–germanium alloys and metal and nitride thin films. He also served as the Director for the Applied-Materials Yonsei Emerging Research Center (AYET) from 2009 to 2014. He is the author of more than 200 technical publications in international journals and filed or awarded more than 50 patents. His main research interests include advanced thin-film technology focusing on atomic layer deposition (ALD) and nanoscale device fabrication.
Dr. Kim is a member of the American Vacuum Society. He is also a member of the Organizing Committee for several international conferences, including the American Vacuum Society, the Materials Research Society, and the Topical Conference on Atomic Layer Deposition. He is also an Editorial Board Member of Thin Solid Films and Metals and Materials International. He has also given invited lectures/presentations at numerous technical conferences and is active in conference organizing. He served as the Organizing Chair for the 2006 ALD Topical Conference on ALD, Seoul.
Research Interests
Papers共 5 篇Author StatisticsCo-AuthorSimilar Experts
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Advanced Materials Interfacesno. 14 (2021): 2170080
Advanced Materials Technologiesno. 3 (2019)
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