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论文共 49 篇作者统计合作学者相似作者

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Towards TSV-Compatible Microfluidic Cooling for 3D ICs
Geyu Yan, Euichul Chung, Erik Masselink,Shane Oh,Muneeb Zia,Bharath Ramakrishnan,Vaidehi Oruganti,Husam Alissa,Christian Belady, Yunhyeok Im,Yogendra Joshi,Muhannad S. Bakir
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 1 (2025): 104-112
引用0浏览0EIWOS引用
0
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Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
Euichul Chung, Geyu Yan,Bharath Ramakrishnan,Husam Alissa,Vaidehi Oruganti,Christian Belady,Erik W. Masselink,Muhannad S. Bakir
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1479-1484, (2024)
引用1浏览0EIWOS引用
1
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Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
Bharath Ramakrishnan, Cam Turner,Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston,Christian Belady,Vaidehi Oruganti
Journal of Electronic Packagingpp.1-19, (2024)
引用0浏览0引用
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Experimental Performance of Supercritical Carbon Dioxide Within Cold Plates Made with Additive Manufacturing Techniques
Wyatt Stottlemyre,Alec Nordlund,Bharath Ramakrishnan, Ruslan Nagimov,Husam Alissa,Joshua Gess
2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)pp.1-6, (2023)
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0
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Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years
G. Refai-Ahmed, V. Gektin,H. Alissa,G. Subbarayan, J. Huttunen, G B. Chan
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1022-1025, (2023)
引用0浏览0EIWOS引用
0
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Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU
Gamal Refai-Ahmed,Md Malekkul Islam, H. Kabbani,T. Cader,Husam Alissa,Hoa Do
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.890-897, (2022)
引用4浏览0EIWOS引用
4
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作者统计

#Papers: 49

#Citation: 527

H-Index: 13

G-Index: 21

Sociability: 4

Diversity: 1

Activity: 10

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