基本信息
浏览量:8
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个人简介
Hung-Jen Chang received the B.S. degree in materials science and engineering from I-Shou University, Kaohsiung, Taiwan, in 2005, and the M.S. degree in material engineering from the National Pingtung University of Science and Technology, Pingtung, Taiwan, in 2007. He is currently pursuing the Ph.D. degree in engineering science at National Cheng Kung University, Tainan, Taiwan.
His current research interests include structural stress simulation, mechanical properties and characterization of materials, and investigation of flip chip interconnect in electronic packages or assemblies.
研究兴趣
论文共 8 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2011): 1747-1754
作者统计
#Papers: 8
#Citation: 36
H-Index: 3
G-Index: 5
Sociability: 3
Diversity: 1
Activity: 0
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