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Bio
He has more than 40 years of experience in materials characterization for semiconductor applications, in particular with transmission electron microscopy, scanning electron microscopy, focused ion beam, auger spectroscopy, spectroscopic ellipsometry, infrared spectroscopy, etc. In these fields, he is the author or coauthor of more than 300 journal articles, 500 conference contributions, and five book chapters. His current interests include materials analysis for advanced 3D semiconductor devices and beyond CMOS technologies focusing on transmission electron microscopy for strain analysis, electron and EDS tomography, MX2 materials, chemical analysis by STEM/EDS/EELS/ELNES and hybrid analysis combining TEM and Raman spectroscopy, and atom probe or SPM techniques.
Research Interests
Papers共 286 篇Author StatisticsCo-AuthorSimilar Experts
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C. Claeys,P.-C. Hsu,Y. Mols, H. Han,H. Bender,F. Seidel,P. Carolan,C. Merckling,A. Alian,N. Waldron,G. Eneman,N. Collaert,
ECS Journal of Solid State Science and Technologyno. 3 (2020)
IEEE Conference Proceedings (2020): 1-2
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C. Claeys,P.-C. Hsu,Y. Mols, H. Han,H. Bender,F. Seidel,P. Carolan,C. Merckling,A. Alian,N. Waldron,G. Eneman,N. Collaert,
ECS Journal of Solid State Science and Technologyno. 3 (2020)
Werkhoven Chris, Granneman Ernst, Kwakman Loek, Hendriks Menso,Verhaverbeke Steven,Heyns Marc,Bender Hugo
ECS Journal of Solid State Science and Technologyno. 4 (2020)
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