基本信息
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Bio
Huayan Wang (Member, IEEE) received the B.S. degree in mechanical engineering from Huazhong University of Science and Technology, Wuhan, China, in 2011, and the Ph.D. degree in mechanical engineering from the State University of New York at Binghamton, Binghamton, NY, USA, in 2019.
He is currently a Senior Packaging Engineer with Xilinx, San Jose, CA, USA.
Research Interests
Papers共 28 篇Author StatisticsCo-AuthorSimilar Experts
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JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2024): 1-37
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.303-309, (2023)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-9, (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2021): 161-168
Gamal Refai-Ahmed,Huayan Wang,Suresh Ramalingam, Nagadeven Karunakaran,Ke Pan,SB Park, Alegesen Soundarajan,Sreedharan Kelappen Kanaran,C. Key Chung,Yu Lung Huang
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Author Statistics
#Papers: 26
#Citation: 344
H-Index: 13
G-Index: 17
Sociability: 4
Diversity: 2
Activity: 7
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