Hsien-Chie Cheng

Hsien-Chie Cheng (M'01) received the B.S. degree in civil engineering from National Cheng Kung University (NCKU), Tainan, Taiwan, R.O.C, in 1985, and the Ph.D. degree in applied mechanics from the University of Michigan, Ann Arbor, in 1994. He is Associate Professor of Aerospace and System Engineering at Feng Chia University (FCU), Taichung, Taiwan. Prior to FCU, in 1994, he joined the R&D Division, National Center for High-Performance Computing (NCHC), Taiwan, as an Associate Research Scientist, and in 1998, became the leader of the Computational Solid Mechanics Laboratory, NCHC. He has published more than 60 conference/journal papers in the areas of CAE, structural optimization, and electronic packaging. His current main research activities are focused on thermal management, design optimization, thermal-mechanical analysis, and solder joint reliability of advanced packaging, including 3-D stacked MCM, wafer-level CSP, and MEMS packaging. Dr. Cheng is a Member of ASME.