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IEEE Electron Device Lettersno. 99 (2024): 1-1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1312-1316, (2024)
Tsung- Yu Ouyang,Yu-Min Lin, Yu-Ping Chan,Ou-Hsiang. Lee,Ching-Kuan Lee,Hsiang-Hung Chang,Chin-Hung Wang,Wei-Chung Lo, Po- Yao Chuang, Ying-Chung Tseng, Po-Hao Tsai, Michael Gallagher,
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
2024 International Conference on Electronics Packaging (ICEP) (2024)
2024 International Conference on Electronics Packaging (ICEP)pp.77-78, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.399-403, (2024)
Mu-Ping Hsu, Wen-Tsu Tsai,Ou-Hsiang Lee, Chi-Yu Chen,Tzu-Ying Kuo,Hsiang-Hung Chang,Hsin-Chi Chang,Zhong-Jie Hong,Kuan-Neng Chen
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2131-2135, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (2024)
2024 International Conference on Electronics Packaging (ICEP) (2024)
Applied Surface Sciencepp.160103, (2024)
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