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One of Holger Kleinke's newest projects is to utilize Cu ion mobility to lower the thermal conductivity of thermoelectric materials. This mobility has to be localized within each unit cell in order to inhibit Cu ion migration throughout the material, which would otherwise cause device degradation. Since the thermoelectric properties depend on the thermopower as well as on the electrical and thermal conductivity, various property measurements are routinely carried out in the group. The syntheses are guided by calculations performed by students who are fascinated by the theoretical aspects of chemical research.
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ADVANCED FUNCTIONAL MATERIALS (2024)
ADVANCED ENERGY AND SUSTAINABILITY RESEARCHno. 2 (2024)
Inorganic Chemistry (2024)
Advanced Energy and Sustainability Researchno. 2 (2024): n/a-n/a
Materialsno. 8 (2024): 1712
ACS APPLIED ELECTRONIC MATERIALS (2023)
JOURNAL OF MATERIALS CHEMISTRY Cno. 34 (2023): 11643-11652
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