基本信息
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个人简介
Siowling Ho received the Ph.D. degree in mechanical engineering from the National University of Singapore, Singapore.
She is currently a Scientist with the Institute of Microelectronics, Agency for Science, Technology and Research, Singapore. She is responsible for projects that are related to advanced packaging, electronics for aerospace applications, and packaging solutions for power electronics. Her current research interests include delamination, modeling of material failure processes, and simulation of mechanical phenomena observed in electronics packaging.
研究兴趣
论文共 67 篇作者统计合作学者相似作者
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期刊级别
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.29-34, (2023)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.598-602, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.655-659, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1376-1383, (2022)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.672-676, (2021)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.637-641, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2035-2042, (2021)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.642-648, (2021)
2020 International Wafer Level Packaging Conference (IWLPC) (2020): 01-07
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作者统计
#Papers: 67
#Citation: 1037
H-Index: 17
G-Index: 30
Sociability: 6
Diversity: 1
Activity: 0
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