Ho-Chiao Chuang received the B.S. degree in mechanical engineering from Dayeh University, Changhua, Taiwan, in 2000, and the M.S. degree from the Department of Power Mechanical Engineering, National Tsinghua University, Beijing, Taiwan, in 2002. He joined the Professor Victor Bright’s MEMS Group in 2004, and received the Ph.D. degree from the Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO, USA, in 2008. He has been an Associate Professor of Mechanical Engineering with the National Taipei University of Technology, Taipei, Taiwan, since 2013. His current research interests include the fabrication of through-silicon-via (TSV) for 3-D IC, ultrahigh aspect ratio of the TSV using the supercritical CO2 electroplating process, and the development of new biomedical instruments, in particular, the aspect of counteraction treatment couch for respiration induced tumor motion.