Hiroyuki Shinoda(篠田裕之)
教授
Department of Complexity Science and Engineering
Graduate School of Frontier Sciences, The University of Tokyo;Department of Information Physics and Computing, Graduate School of Information Science and Technology, The University of Tokyo;Department of Mathematical Engineering and Information Physics, School of Engineering, The University of Tokyo
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基本信息
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个人简介
The basic research style of our lab is to apply mathematical and physical modeling skill to real-world complex problems of sensing and interactive systems. And I also like making things physically. So Haptics, the emerging scientific/technological field on touch, is the best theme for me now. It can potentially solve many practical problems of the human society, and simultaneously haptic interaction is reasonably difficult to understand and technically challenging. Midair haptics born from these activities is now advancing and becoming a powerful tool for science and practical applications.
Another important research topic is two-dimensional communication that is a physical technology to transmit information and power with electromagnetic waves traveling along a thin sheet. We initially proposed such two-dimensional connection for haptics, to realize wireless tactile-receptor sensors for elastic and tough sensor skin. The technology enhances the environment where wireless and battery-free items can work. It also contributes to wearable haptic devices.
Another important research topic is two-dimensional communication that is a physical technology to transmit information and power with electromagnetic waves traveling along a thin sheet. We initially proposed such two-dimensional connection for haptics, to realize wireless tactile-receptor sensors for elastic and tough sensor skin. The technology enhances the environment where wireless and battery-free items can work. It also contributes to wearable haptic devices.
研究兴趣
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IEEE transactions on hapticsno. 99 (2024): 1-12
2023 IEEE International Conference on Systems, Man, and Cybernetics (SMC)pp.4914-4919, (2023)
CoRR (2023)
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IEEE transactions on hapticsno. 4 (2023): 695-701
WHCpp.210-215, (2023)
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