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论文共 41 篇作者统计合作学者相似作者

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Waveform Generation and Signal Routing for RF Applications: A DDS-Based Approach with Microcontroller Integration
Venkatesh C Badiger,Hemanth Kumar C,Girija S, Sumanth M N, K Sukanya, Madiwalesh M Patter
2024 International Conference on Integrated Circuits and Communication Systems (ICICACS)pp.1-6, (2024)
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Stability Analysis of Mixed Convection of Nanofluid Flow Through a Horizontal Porous Channel Using LTNE Model
Harsha S V, Chandra Shekara G,Hemanth Kumar C, Mayur D H
Microgravity Science and Technologyno. 6 (2024): 1-21
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Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications
Hemanth Kumar Cheemalamarri, Masahisa Fujino,Ji Hong Miao, Everline Teo,Vempati Srinivasa Rao,Navab Singh
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)pp.1-1, (2024)
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications
Hemanth Kumar Cheemalamarri,Tran Van Nhat Anh,Chen Gim Guan, Meng Keong Lim,Srinivasa Rao Vempati,Navab Singh
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1880-1884, (2024)
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Sub-0.5 Μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
Hemanth Kumar Cheemalamarri,Arvind Sundaram, San Sandra,Tran Van Nhat Anh, Bhesetti Chandra Rao,Chen Gim Guan,Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun,Vempati Srinivasa Rao,Navab Singh
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.803-808, (2024)
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Missing Child Recognition System Using Deep Learning
V. Geetha,C. K. Gomathy, B. Kasyap,C. Hemanth Kumar
INTERNATIONAL CONFERENCE ON EMERGING TRENDS IN ELECTRONICS AND COMMUNICATION ENGINEERING - 2023 AIP Conference Proceedings (2024)
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Utilising Physics-Informed Neural Networks for Optimisation of Diffusion Coefficients in Pseudo-Binary Diffusion Couples
Hemanth Kumar,Neelamegan Esakkiraja,Anuj Dash,Aloke Paul,Saswata Bhattacharyya
The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physicsno. 18 (2023): 1717-1737
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
Simon Chun Kiat Goh,Cheemalamarri Hemanth Kumar,Liangxing Hu, Woon Shervonne,Norhanani Jaafar, Yap Lee Khoon Sherry,Ding Huang,Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li,Chuan Seng Tan,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.404-408, (2023)
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作者统计

#Papers: 41

#Citation: 167

H-Index: 6

G-Index: 12

Sociability: 4

Diversity: 1

Activity: 2

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