Hangxing Liu

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Hangxing Liu (Student Member, IEEE) received the B.S. degree from Case Western Reserve University, Cleveland, OH, USA, in 2019, and the M.S. degree from the University of Pennsylvania, Philadelphia, PA, USA, in 2021. He is currently working toward the Ph.D. degree with the Department of Information Technology and Electrical Engineering, ETH Zürich, Zürich, Switzerland. His research interests include CMOS-based bioelectronics for cellular and molecular monitoring, and implantable microsensors.

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