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个人简介
Harry Hsia was born in Taipei, Taiwan. He received the B.S. degree in electrical engineering from the National Taiwan University, Taipei, in 1991, the M.S. degree in electrical engineering from the University of Southern California, Los Angeles, in 1995, and the Ph.D. degree in electrical engineering from the University of Illinois, Urbana, in 1999.
His research interest has been in process development, device, and integration in compound semiconductor optoelectronics. He was with Philips-Lumileds Lighting Company, San Jose, CA, and Infinera Corporation, Sunnyvale, CA, working on high-brightness light-emitting diodes and photonic integrated circuits, respectively. He joined Taiwan Semiconductor Manufacturing Company, Hsinchu, as a Technical Manager in May 2005, where he worked on 45-nm-technology front-end process integration with emphasis on silicon germanium and then on 22-nm-technology front-end device development with emphasis on high-$k$ gate dielectrics. He is currently working on process and device integration in optoelectronic devices with emphasis on silicon-based gallium nitride epitaxy and wafer-level high-performance package for photonic devices.
研究兴趣
论文共 6 篇作者统计合作学者相似作者
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Chih-Hsin Lu, Chia-Chia Lin, Tzu-Chun Tang, Chung-Yi Lin, Jay Chang,Chung-Hao Tsai,Harry Hsia, J. C. Twu, C. S. Liu,Gene Wu,Kuo-Chung Yee,Douglas C.H. Yu
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.893-897, (2024)
Chua-Chin Wang, Shih-Heng Luo,Hsin-Che Wu,Ralph Gerard B. Sangalang, Chewn-Pu Jou,Harry Hsia, Lan-Chou Cho
2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS)pp.85-89, (2024)
Harry Hsia, C. W. Tseng,C. C. Chang,C. Y. Wu,S. P. Tai, S. W. Lu,Jason Wu,C. H. Tung,C. S. Liu,Yutung Wu,K. C. Yee,Douglas C. H. Yu
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.612-616, (2023)
Ralph Gerard B. Sangalang, Shih-Heng Luo,Hsin-Che Wu, Bao-Qi He,Shen-Fu Hsiao,Chua-Chin Wang,Chewnpu Jou,Harry Hisia, Douglas C-H. Yi
2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)pp.46-49, (2022)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.263-268, (2021)
2021 IEEE International Electron Devices Meeting (IEDM) (2021)
作者统计
#Papers: 5
#Citation: 13
H-Index: 2
G-Index: 2
Sociability: 3
Diversity: 0
Activity: 0
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