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Papers共 19 篇Author StatisticsCo-AuthorSimilar Experts
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Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik,A. Chatterjee, P. C. Chiu,T. Chu, C. Firby,
VLSI Technology and Circuitspp.1-2, (2023)
Chetan Prasad,Sunny Chugh,Hannes Greve, I-chen Ho,Enamul Kabir, Cheyun Lin,Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park,Anthony Schmitz,Zhizheng Zhang,
Journal of Electronic Packagingno. 2 (2018)
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)pp.1-7, (2017)
CIPS 2016; 9th International Conference on Integrated Power Electronics Systemspp.1-10, (2016)
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1072-1077, (2016)
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2 (2015)
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