H. Bender

Hugo Bender is currently a Principal Member Technical Staff with the Materials and Components Analysis (MCA) Department, imec. He has more than 40 years of experience in materials characterization for semiconductor applications, in particular with transmission electron microscopy, scanning electron microscopy, focused ion beam, auger spectroscopy, spectroscopic ellipsometry, infrared spectroscopy, etc. In these fields, he is the author or coauthor of more than 300 journal articles, 500 conference contributions, and five book chapters. His current interests include materials analysis for advanced 3D semiconductor devices and beyond CMOS technologies focusing on transmission electron microscopy for strain analysis, electron and EDS tomography, MX2 materials, chemical analysis by STEM/EDS/EELS/ELNES and hybrid analysis combining TEM and Raman spectroscopy, and atom probe or SPM techniques.