基本信息
views: 45
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
Bio
No content for now
Research Interests
Papers共 93 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Kirsten Weide-Zaage, Satria-Jaya Mandala, Eike Trumann,Guillermo Payá-Vayá, Dorian von Wolff, Andre Bausen, Alexander Müller
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2024)
Eike Trumann,Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage, Dorian von Wolff, Andre Bausen, Alexander Müller,Guillermo Payá-Vayá
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
Gia Bao Thieu,Sven Gesper,Guillermo Paya-Vaya,Christoph Riggers, Oliver Renke, Till Fiedler, Jakob Marten,Tobias Stuckenberg,Holger Blume,Christian Weis,Lukas Steiner,Chirag Sudarshan,
2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATEpp.1-6, (2023)
Sven Gesper, Gia Bao Thieu, Daniel Köhler, Markus Kock, Tim Berthold, Oliver Renke,Holger Blume,Guillermo Payá Vayá
International Conference on Consumer Electronics - Berlinpp.94-99, (2023)
Eike Trumann,Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage,Katharina Schmidt, Dorian Hagenah,Guillermo Paya Vaya
APPLIED RECONFIGURABLE COMPUTING. ARCHITECTURES, TOOLS, AND APPLICATIONS, ARC 2023 (2023): 357-360
Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage,Katharina Schmidt, Dorian Hagenah,Guillermo Payá-Vayá
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
APPLIED RECONFIGURABLE COMPUTING. ARCHITECTURES, TOOLS, AND APPLICATIONS, ARC 2023 (2023): 307-321
2023 IEEE 34th International Conference on Application-specific Systems, Architectures and Processors (ASAP)pp.61-68, (2023)
Embedded Computer Systems: Architectures, Modeling, and Simulation: 23rd International Conference, SAMOS 2023, Samos, Greece, July 2–6, 2023, Proceedingspp.225-240, (2023)
Load More
Author Statistics
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn