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个人简介
Guillermo Payá-Vayá received the Ing. degree from the School of Telecommunications Engineering, Universidad Politécnica de Valencia, Spain, in 2001, and the Ph.D. degree from the Department of Architecture and Systems, Institute of Microelectronic Systems, Leibniz Universität Hannover, Germany, in 2011. From 2001 to 2004, he was a member of the Research Group of Digital System Design, Universidad Politécnica de Valencia, where he was involved in VLSI dedicated architecture design of signal and image processing algorithms using pipelining, retiming, and parallel processing techniques. In 2004, he joined the Department of Architecture and Systems, Institute of Microelectronic Systems, Leibniz Universität Hannover, where he is currently a Junior Professor.
研究兴趣
论文共 90 篇作者统计合作学者相似作者
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Eike Trumann, Amen Allah Bahri, Gia Bao Thieu, Kirsten Weide-Zaage, Dorian Von Wolff, Andre Bausen, Alexander Müller,Guillermo Payá-Vayá
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2025)
Embedded Computer Systems Architectures, Modeling and Simulationpp.246-261, (2024)
2024 IEEE 35TH INTERNATIONAL CONFERENCE ON APPLICATION-SPECIFIC SYSTEMS, ARCHITECTURES AND PROCESSORS, ASAP 2024pp.1-2, (2024)
IEEE Nordic Circuits and Systems Conferencepp.1-6, (2024)
Embedded Computer Systems Architectures, Modeling and Simulationpp.167-182, (2024)
2024 13TH INTERNATIONAL CONFERENCE ON MODERN CIRCUITS AND SYSTEMS TECHNOLOGIES, MOCAST 2024 (2024)
Journal of Signal Processing Systemspp.1-24, (2024)
Kirsten Weide-Zaage, Satria-Jaya Mandala,Eike Trumann,Guillermo Payá-Vayá, Dorian von Wolff, Andre Bausen, Alexander Müller
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2024)
Eike Trumann,Gia Bao Thieu, Johannes Schmechel,Kirsten Weide-Zaage, Dorian von Wolff, Andre Bausen, Alexander Müller,Guillermo Payá-Vayá
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
Gia Bao Thieu,Sven Gesper,Guillermo Paya-Vaya,Christoph Riggers,Oliver Renke, Till Fiedler,Jakob Marten,Tobias Stuckenberg,Holger Blume,Christian Weis,Lukas Steiner,Chirag Sudarshan,Norbert Wehn,Lennart M. Reimann,Rainer Leupers,Michael Beyer,Daniel Koehler,Alisa Jauch,Jan Micha Borrmann, Setareh Jaberansari, Tim Berthold,Meinolf Blawat,Markus Kock,Gregor Schewior,Jens Benndorf,Frederik Kautz,Hans-Martin Bluethgen,Christian Sauer
2023 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATE (2023)
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作者统计
#Papers: 90
#Citation: 439
H-Index: 10
G-Index: 15
Sociability: 5
Diversity: 2
Activity: 1
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