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Papers共 113 篇Author StatisticsCo-AuthorSimilar Experts
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ELECTRONICSno. 5 (2023): 1198-1198
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-4, (2022)
2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)pp.110-115, (2022)
I. Dolenc Kittelmann, F. dos Santos Alves, E. Bergman, C. Derrez, V Grishin, K. Rosengren, T. J. Shea,P. Legou, Y. Mariette, V Nadot,T. Papaevangelou,L. Segui,
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