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Research fields
Complex system approach to microwave circuit stability assessment
Efficient sensitivity simulation of semiconductor devices
Electro-optic and Electro-absorption modulators
Electromagnetics and food
Full-band Monte Carlo electron transport simulation
High-speed switching power semiconductor devices
Microwave circuit and system design
Noise device simulation
Semiconductor devices for microwave power applications
Si and III-V photonic integrated circuits
Wireless communications systems in harsh and hostile environments
Complex system approach to microwave circuit stability assessment
Efficient sensitivity simulation of semiconductor devices
Electro-optic and Electro-absorption modulators
Electromagnetics and food
Full-band Monte Carlo electron transport simulation
High-speed switching power semiconductor devices
Microwave circuit and system design
Noise device simulation
Semiconductor devices for microwave power applications
Si and III-V photonic integrated circuits
Wireless communications systems in harsh and hostile environments
研究兴趣
论文共 343 篇作者统计合作学者相似作者
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IEEE PHOTONICS JOURNALno. 1 (2024): 1-8
Journal of Lightwave Technologyno. 99 (2024): 1-8
EUROCONpp.552-557, (2023)
Aldo Romani, Marco Crescentini, Cristina Rusu,Henrik Staaf, Marco Ambrosio,Marcello Chiaberge, Anna Piacibello,Marco Pirola,Gemma Giliberti,Federica Cappelluti,Giovanni Ghione,Mike Hayes,
2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE)pp.1-6, (2023)
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M. Vallone, M. G. C. Alasio, A. Tibaldi, F. Bertazzi, S. Hanna, D. Eich, A. Wegmann, H. Figgemeier,G. Ghione, M. Goano
2023 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)pp.25-26, (2023)
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Proceedings of SIE 2022pp.155-159, (2023)
Conference on Lasers and Electro-Opticspp.1-2, (2022)
2022 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)pp.5-6, (2022)
IEEE Transactions on Electron Devicesno. 12 (2022): 6509-6509
2021 16th European Microwave Integrated Circuits Conference (EuMIC)pp.189-192, (2022)
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