基本信息
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Bio
Giovanni Capuz received the B.Sc. degree in electrical engineering at the Technological Institute of the Philippines, Manila, Philippines, in 1996. He earned 95 percentile rank in the National Licensure board examination for Registered Electrical Engineers. He worked in the industrial aspect of semiconductor advanced packaging Flip chip and BGA/SiP/MCM in different OSATs in Asia for 15 years. He is currently an R&D Project Leader in IMEC, Belgium, for 10 years, with past assignment on research about 3D/2.5D stacking and D2W assemblies. He is currently working on NPI projects for packaging ASICs through ICLink, the industrial arm of IMEC.
Research Interests
Papers共 21 篇Author StatisticsCo-AuthorSimilar Experts
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1108-1113, (2022)
2022 International Conference on Electronics Packaging (ICEP)pp.131-132, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1108-1113, (2022)
Jaber Derakhshandeh, Carine Gerets, Fumihiro Inoue,Giovanni Capuz, Vladimir Cherman, Melina Lofrano, Lin Hou, Tom Cochet,Inge De Preter,Tomas Webers, Pieter Bex,Geraldine Jamieson,
Electronic Components and Technology Conferencepp.1119-1124, (2021)
Journal of Microelectronics and Electronic Packagingno. 1 (2021): 12-20
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2020): 1-1
International Symposium on Microelectronicsno. 1 (2020): 000185-000191
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.617-622, (2020)
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Author Statistics
#Papers: 21
#Citation: 111
H-Index: 6
G-Index: 6
Sociability: 4
Diversity: 1
Activity: 2
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