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Bio
Ger Kelly (SM’00) is an internationally recognized expert in
numerical analysis of thermal and thermomechanical phenomena in microelectronics and microsystems packaging, primarily
gained through participation in collaborative research projects at EU on national level in the National
Microelectronics Research Centre and more recently Cork Institute of Technology. He has given invited talks at
Microsystems conferences in USA and Europe and preconference courses in USA on thermomechanical phenomena in
microelectronics. He has circa 50 publications in his field of interest including one book.
Dr. Kelly has been the Vice-Chair of the IEEE CPMT technical Committee TC-9 on thermal management and
thermomechanical design for ten years.
Research Interests
Papers共 51 篇Author StatisticsCo-AuthorSimilar Experts
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JOURNAL OF APPLIED AND COMPUTATIONAL MECHANICSno. 3 (2023): 728-738
RENEWABLE & SUSTAINABLE ENERGY REVIEWS (2021): 110699
Lecture Notes in Civil EngineeringProceedings of the 1st Vietnam Symposium on Advances in Offshore Engineeringpp.485-491, (2018)
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