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Bio
He has significantly advanced this scientific field through his development of ground-breaking electronics cooling technologies. His engineering practice has not only impacted the academic community, but has also greatly influenced the consumer electronics, telecommunications and energy industries.Due to his pivotal discoveries, many types of electronic systems are able to maintain a higher performance even among the most challenging circumstances. His inventions have also led to improved performance, versatile, reliable, and commercially viable electronic systems for a wide variety of product offerings. He is the author of more than 90 technical papers and more than 100 US patents/ International Patents/ Pending patents. Dr. Refai is an Associate Editor of Journal Components and Packaging, IEEE and Journal of thermal Sciences and Engineering and Applications, Transactions of the ASME. Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2015, the ASME service award and the 2016 IEEC SUNY Binghamton Innovation leader of the year.
Research Interests
Papers共 118 篇Author StatisticsCo-AuthorSimilar Experts
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.303-309, (2023)
G. Refai-Ahmed, S. Ramalingam, N. Karunakaran, M. Baharom, P. Yin, H. Do, C. Lee, S. Kelappen, P. Ramachandran, B. Murthy, B. Michael
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.834-841, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1022-1025, (2023)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.890-897, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.920-925, (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-9, (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.909-913, (2022)
Gamal Refai-Ahmed,Suresh Ramalingam,Tahir Cader,Jason Strader, Jari Huttunen,Anthony Torza,Srikanth Rangarajan,Bahgat Sammakia,Vadim Gektin, Hussam Kabbani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.530-537, (2021)
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Author Statistics
#Papers: 104
#Citation: 1453
H-Index: 25
G-Index: 29
Sociability: 5
Diversity: 1
Activity: 4
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