按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
ACS Applied Electronic Materials (2024)
0
0
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.199-203, (2023)
EIWOS
0
0
Journal of Japan Institute of Electronics Packagingno. 1 (2023): 172-177
0
0
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
EIWOS
0
0
2023 International Conference on Electronics Packaging (ICEP)pp.105-106, (2023)
EIWOS
1
0
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.556-563, (2023)
EIWOS
0
0
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