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Papers共 63 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.901-905, (2023)
Prashant Kumar Singh,Patrick Rohlfs, Gunther Sandmann,Kashi Vishwanath Machani, Dirk Breuer,Karsten Meier,Frank Kuechenmeister,Marcel Wieland,Karlheinz Bock
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2023)
Viktor Dudash,Kashi Vishwanath Machani,Karsten Meier, Holm Geisler, Maik Mueller,Frank Kuechenmeister, Marcel Wieland,Karlheinz Bock
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.757-763, (2023)
2023 IEEE International Reliability Physics Symposium (IRPS)pp.1-6, (2023)
2022 45th International Spring Seminar on Electronics Technology (ISSE)pp.1-6, (2022)
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.1100-1105, (2020)
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