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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 72 篇作者统计合作学者相似作者

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Active area patterning for CFET: nanosheet etch
Vincent Brissonneau, Il Gyo Koo, Maryam Hosseini,Dmitry Batuk,Anabela Veloso,Geert Mannaert,Frédéric Lazzarino
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
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Dry etch challenges for patterning middle-of-line (MOL) contact trench in monolithic CFET (complementary FET)
Tanushree Sarkar,Dunja Radisic,Victor Vega Gonzalez, Karen Stiers, Cassie Sheng, Daniel Montero Alvarez, Hailey Jenkins,Marc Demand, Peng Wang,Frédéric Lazzarino,Naoto Horiguchi
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
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Patterning spacer source drain cavities in CFET devices
Subhobroto Choudhury,Geert Mannaert, Lucas Petersen Barbosa Lima,Steven Demuynck, Il Gyo Koo,Frédéric Lazzarino
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
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Extreme UV self-aligned double patterning process optimization for BEOL interconnections on 3nm nodes and beyond
Daniel Montero Alvarez, Nunzio Buccheri, Quyang Lin, Syamashree Roy,Sara Paolillo,Chen Wu, Yannick Hermans,Stefan Decoster, Bart Baudemprez, Jan-Frederik Finoulst,Frédéric Lazzarino,Seongho Park,
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
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Assessment of STI dry etch process variability by means of dynamic time warping technique
Alexey P. Milenin, B. T. Chan,Frederic Lazzarino
JAPANESE JOURNAL OF APPLIED PHYSICSno. SI (2023): SI1004-SI1004
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Middle-of-line plasma dry etch challenges for Buried Power Rail integration
Dunja Radisic,A. Veloso,A. Gupta,M. Hosseini, S. Wang, H. Mertens, B. T. Chan,D. Batuk,G. T. Martinez,F. Lazzarino,E. D. Litta,N. Horiguchi
ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XI (2022)
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Tone reversal patterning for advanced technology nodes
F. Schleicher,J. Bekaert,A. Thiam, S. Decoster,R. Blanc,F. Lazzarino, J. Garcia Santaclara, G. Rispens, M. Maslow
ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XI (2022)
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Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below
D. Montero, V. Vega-Gonzalez, Y. Feurprier,O. Varela Pedreira, N. Oikawa,G.T. Martinez,D. Batuk,H. Puliyalil, J. Versluijs, H. Decoster, N. Bazzazian, N. Jourdan,
2022 IEEE International Interconnect Technology Conference (IITC)pp.48-50, (2022)
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