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Research Interests

Papers共 171 篇Author StatisticsCo-AuthorSimilar Experts

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Investigation on memory package crack and prevention under temperature cycling test
Fa Xing Che,Yeow Chon Ong,Hong Wan Ng, C.L. Gan,Gokul Kumar
Materials Science in Semiconductor Processing (2024): 108560
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Integration of Artificial Neural Network and Finite Element Simulation for Package Warpage Prediction
Sunil Kumar Panigrahy,Fa Xing Che,Yeow Chon Ong, Prasad Nagavenkata Nune,Hong Wan Ng
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.926-931, (2023)
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Quick Assessment Methodology for Thermal Impedance Prediction Apply to IC Package
Jin Yuan Lai, Shin Yueh Yang,Yeow Chon Ong,Fa Xing Che,Hong Wan Ng
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.191-194, (2023)
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Effect of Underfill on Substrate Trace Crack under PTC
Wei Yu, Ling Pan, Kelvin Tan Aik Boo,Fa Xing Che,Yeow Chon Ong,Hong Wan Ng, Richard Fan
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.678-682, (2023)
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Design Optimization to Boost Solder Joint Reliability Performance for SSD BGA Package
Ling Pan,Fa Xing Che, Wei Yu,Yeow Chon Ong,Hong Wan Ng, Kelvin Aik Boo Tan, Wen Wei Lum,Koustav Sinha, Ting Wen Chen
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.674-677, (2023)
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Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package
Fa Xing Che,Yeow Chon Ong, Ling Pan,Wren Chen, Wei Yu,Hong Wan Ng
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.705-709, (2023)
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Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products
Yun-Ting Hsu, Yung-Sheng Zou,Min-Hua Chung,Chong-Leong Gan, Venkatesh Venkatraman, Anila Paul, Winnie Low,Faxing Che
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)pp.1-5, (2023)
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Substrate Copper Trace Crack Characterization and Simulation
Wei Yu,Faxing Che,Vance Liu, Milly Lin, Jay Lin, Brad Rumsey,Christopher Glancey,Yeow Chon Ong,Hong Wan Ng
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.699-705, (2023)
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