基本信息
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Bio
Fabrice F. C. Duval worked on piezoelectric MEMS, with a focus on piezoelectric micro-machined ultrasonic transducers (pMUT), graduating with a Ph.D. entitled “PZT thick films for high frequency transducers” from Cranfield University, U.K., in 2003, followed with post-doctoral research, first at Cranfield University, from 2003 to 2005, and then at the Institut d’Electronique, de Microélectronique et de Nanotechnologie (IEMN), Villeneuve-d’Ascq, France, from 2005 to 2007. Since 2007, he joined imec, Leuven, Belgium, where he has been working on many different projects in the field of 3-D packaging and integration, focusing on the materials process development and characterization.
Research Interests
Papers共 30 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 7 (2021): 1073-1080
Journal of Microelectronics and Electronic Packagingno. 1 (2021): 12-20
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1252-1257, (2021)
International Symposium on Microelectronicsno. 1 (2020): 000185-000191
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.617-622, (2020)
J. Derakhshandeh, C. Heyvaert,F. Beirnaert, T. Cochet,P. Bex, L. Hou,M. Lofrano,G. Jamieson,N. Heylen,S. Suhard,M. Honore,E. Beyne,
ECS Meeting Abstractsno. 33 (2018): 1135-1135
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Author Statistics
#Papers: 31
#Citation: 302
H-Index: 9
G-Index: 17
Sociability: 5
Diversity: 2
Activity: 0
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