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个人简介
Fei Yang (Member, IEEE) received the B.S. degree from Northwestern Polytechnical University, Xi’an, China, in 2011, and the M.S. degree from the Center for Ultra-Wide-Area Resilient Electric Energy Transmission Networks (CURENT), The University of Tennessee, Knoxville, TN, USA, in 2017, both in electrical engineering. He is currently working toward the Ph.D. degree in electrical engineering with The University of Texas at Dallas, Richardson, TX, USA.
From 2012 to 2014, he was a Researcher with the Advanced Power Electronics Lab (APEL), Kettering University, Flint, MI, USA. From 2014 to 2017, he was a Graduate Research Assistant with CURENT, The University of Tennessee, Knoxville, TN, USA. From 2015 to 2017, he was working on packaging related projects with the Power Electronics and Electric Machinery Research Center, Oak Ridge National Laboratory, Oak Ridge, TN, USA. Since 2017, he has been a Graduate Research Assistant with The University of Texas at Dallas. His research interests include wide bandgap semiconductor device's reliability and application, power module packaging and integration, and motor drive system design.
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2024 IEEE International Reliability Physics Symposium (IRPS)pp.1-7, (2024)
2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)pp.1-7, (2023)
IEEE Transactions on Industry Applicationsno. 3 (2022): 3863-3874
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)pp.2258-2264, (2021)
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