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Bio
Eun Sook Sohn received the B.S. and M.S. degrees in physics from Jeonbuk National University, Jeonbuk, Korea, in 1994.
She has over 12 years of working experience in the semiconductor packaging industry, and her research interests are package characterization using mechanical test and modeling, board-level solder joint reliability testing, and material characterization. She is currently working on package characterization in the R&D Center, Material Process Development Team, Amkor Technology, Inc., Seoul, Korea.
Research Interests
Papers共 12 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1498-1503, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.661-664, (2024)
Heejun Jang, Kyun Ahn, Haesung Park,Gamhan Yong,Jihyun Kim, YeonKi Jeong,EunSook Sohn,Dave Hiner,Mike Kelly,Taekyeong Hwang,Wonchul Do,JinYoung Khim
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1027-1031, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1297-1302, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1249-1255, (2022)
JiHun Lee,GamHan Yong,MinSu Jeong,JongHyun Jeon, DongHoon Han, MinKeon Lee,WonChul Do,Eun-Sook Sohn,Michael G. Kelly,Dave Hiner,JinYoung Khim
electronic components and technology conferencepp.96-100, (2021)
electronic components and technology conferencepp.1453-1461, (2008)
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Electronic Components and Technology Conferencepp.507-+, (2007)
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Author Statistics
#Papers: 12
#Citation: 105
H-Index: 4
G-Index: 7
Sociability: 4
Diversity: 1
Activity: 0
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