基本信息
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Bio
Ege Engin received the B.S. degree in 1998 from Middle East Technical University, Ankara, Turkey, and the M.S. degree in 2001 from the University of Paderborn, Paderborn, Germany, both in electrical engineering, and the Ph.D. degree in electrical engineering (summa cum laude) from the University of Hannover, Hannover, Germany.
From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany. Since 2005, he has been with the Packaging Research Center, Georgia Institute of Technology, Atlanta. He is the author or coauthor of more than 50 publications in journals and conferences in the areas of signal and power integrity modeling and simulation. He is the coauthor of Power Integrity Modeling and Design for Semiconductors and Systems (Prentice-Hall, 2007). His current research interests include mixed-signal design, characterization, and test.
Dr. Engin is a Reviewer for the IEEE Transactions on Electromagnetic Compatibility.
Research Interests
Papers共 133 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Letters on Electromagnetic Compatibility Practice and Applicationsno. 3 (2020): 81-84
IEEE Letters on Electromagnetic Compatibility Practice and Applicationsno. 3 (2020): 76-80
International Symposium on Microelectronicsno. 1 (2019): 000243-000247
International Symposium on Microelectronicsno. 1 (2018): 000380-000383
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2017): 525
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2017): 519-525
International Symposium on Microelectronicsno. 1 (2016): 000358-000363
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Author Statistics
#Papers: 135
#Citation: 1861
H-Index: 24
G-Index: 32
Sociability: 5
Diversity: 2
Activity: 0
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