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Research Interests

Papers共 27 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Integration of plasma dicing in the collective die to wafer hybrid bonding process
Samuel Suhard,Koen Kennes,Pieter Bex, Violeta Georgieva,Filip Schleicher,Edward Walsby, Richard Barnett,Anne Jourdain,Gerald Beyer,Eric Beyne
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.144-149, (2023)
Cited0Views0EIWOSBibtex
0
0
Low temperature SiCN as dielectric for hybrid bonding
Venkat Sunil Kumar Channam,Serena Iacovo,Edward Walsby, Igor Belov,Anne Jourdain, Alfonso Sepulveda,Eric Beyne
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2023)
Cited0Views0EIWOSBibtex
0
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Dielectric Breakdown of Low Temperature Deposited SiCN Layers
Lin Hou, Venkat Sunil Kumar Channam,Alicja Lesniewska, Serena Lacovo, Shuo Kang,Joeri De Vos,Anne Jourdain,Gerald Beyer,Kristof Croes,Edward Walsby,Kath Crook, Igor Belov,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Direct Bonding Using Low Temperature SiCN Dielectrics
Serena Iacovo,Fuya Nagano, Venkat Sunil Kumar Channam,Edward Walsby,Kath Crook,Keith Buchanan,Anne Jourdain,Kris Vanstreels,Alain Phommahaxay,Eric Beyne
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.602-607, (2022)
Cited6Views0EIWOSBibtex
6
0
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Samuel Suhard,Koen Kennes,Pieter Bex,Anne Jourdain,Lieve Teugels,Edward Walsby, Chris Bolton,Jash Patel,Huma Ashraf, Richard Barnett,Ferenc Fodor,Alain Phommahaxay,
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2064-2070, (2021)
Cited6Views0EIWOSBibtex
6
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