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Research Interests
InP, GaAs based compound materials and devices (HEMT, HBT) for wireless communication and sub-milimeterwave imaging applications
GaN based materials (MBE, MOCVD) and High frequency & High power electronics (HEMT) applications
III-V/ Si integration (Ge, SiGe, GaAs, InP) for logic applications
Advanced package (Flip chip) for high frequency and power applications
InP, GaAs based compound materials and devices (HEMT, HBT) for wireless communication and sub-milimeterwave imaging applications
GaN based materials (MBE, MOCVD) and High frequency & High power electronics (HEMT) applications
III-V/ Si integration (Ge, SiGe, GaAs, InP) for logic applications
Advanced package (Flip chip) for high frequency and power applications
研究兴趣
论文共 539 篇作者统计合作学者相似作者
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Yan-Kui Liang, Jun-Yang Zheng, Yu-Lon Lin,Yu-Cheng Lu,Dong-Ru Hsieh,Tsung-Te Chou,Chi-Chung Kei,Huai-Ying Huang,Yu-Ming Lin,Yuan-Chieh Tseng,Tien-Sheng Chao,Edward Yi Chang,
Micromachinesno. 1 (2024): 81
Yi-En Chang-Chien,Chin-Han Chung,Chih-Yi Yang,Cheng-Jun Ma, Xiang-You Ye,You-Chen Weng,Edward Yi Chang
IEEE Transactions on Device and Materials Reliabilityno. 99 (2024): 1-1
Yan-Kui Liang, June-Yang Zheng,Yu-Lon Lin, Wei-Li Li,Yu-Cheng Lu, Dong-Ru Hsieh,Li-Chi Peng,Tsung-Te Chou,Chi-Chung Kei,Chun-Chieh Lu,Huai-Ying Huang,Yuan-Chieh Tseng,
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (2023)
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCEno. 16 (2023)
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYno. 3 (2023): 035002-035002
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ano. 1 (2023)
ELECTRONICS LETTERSno. 13 (2023)
Yan-Kui Liang, Jun-Yang Zheng,Yu-Lon Lin,Yu Chen,Kuan-Lun Chen,Dong-Ru Hsieh,Li-Chi Peng,Ching-Hua Chiu, Yu-Chcng Lu,Tsung-Te Chou,Chi-Chung Kei,Chun-Chieh Lu,
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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