基本信息
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Bio
Ehrenfried Zschech is CTO and Co-Founder of deepXscan GmbH, Dresden, Germany. His responsibilities include R&D in the field of high-resolution X-ray imaging and the development of customized solutions for a broad range of applications. Ehrenfried Zschech received his Dr. rer. nat. degree from Dresden University of Technology. After having spent four years as a project leader in the field of metal physics and reliability of microelectronic interconnects at Research Institute for Nonferrous Metals in Freiberg, he was appointed as a university teacher for ceramic materials at Freiberg University of Technology. In 1992, he joined the development department at Airbus in Bremen, where he managed the metal physics group and studied the laser-welding metallurgy of aluminum alloys. From 1997 to 2009, Ehrenfried Zschech managed the Materials Analysis Department and the Center for Complex Analysis at Advanced Micro Devices in Dresden. In this position, he was responsible for the analytical support for process control and technology development in leading-edge semiconductor manufacturing, as well as for physical failure analysis. Ehrenfried Zschech was Department Head at the Fraunhofer Institutes IZFP and IKTS and Head of the Steering Committee of the Dresden Fraunhofer Cluster Nanoanalysis from 2009 to 2021. His responsibilities included multi-scale materials characterization and reliability engineering. Ehrenfried Zschech holds an adjunct professorship at Faculty of Chemistry of Warsaw University as well as honorary professorships for Nanomaterials at Brandenburg University of Technology Cottbus and for Nanoanalysis at Dresden University of Technology. Ehrenfried Zschech is Member of the European Academy of Science (EurASc) and Member of the of the German National Academy of Science and Engineering (ACATECH). In 2019, he was awarded with the FEMS European Materials Gold Medal.
Research Interests
Papers共 255 篇Author StatisticsCo-AuthorSimilar Experts
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Bowen Zhang, Xiaohui Liu,Wei Li,André Clausner, Sylvia Conzendorf, Jinxin Liu,Juliane Posseckardt, Birgit Jost,Renhao Dong,Xinliang Feng,Zhongquan Liao,Ehrenfried Zschech
crossref(2024)
Kristina Kutukova, Bartlomiej Lechowski, Joerg Grenzer, Peter Krueger,Andre Clausner,Ehrenfried Zschech
NANOMATERIALSno. 5 (2024): 448
Journal of Electronic Materialspp.1-9, (2024)
Bartlomiej Lechowski, Kristina Kutukova, Joerg Grenzer,Iuliana Panchenko, Peter Krueger, Andre Clausner,Ehrenfried Zschech
NANOMATERIALSno. 2 (2024): 233
Davood Sabaghi, Zhiyong Wang,Preeti Bhauriyal,Qiongqiong Lu,Ahiud Morag, Daria Mikhailovia,Payam Hashemi,Dongqi Li,Christof Neumann,Zhongquan Liao,Anna Maria Dominic,Ali Shaygan Nia,
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
Stephan Werner,Peter Guttmann,Frank Siewert,Andrey Sokolov, Matthias Mast,Qiushi Huang,Yufei Feng,Tongzhou Li,Friedmar Senf,Rolf Follath, Zhohngquan Liao,Kristina Kutukova,
IEEE Transactions on Device and Materials Reliabilityno. 1 (2023): 80-88
MATERIALSno. 14 (2023): 5094-5094
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