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个人简介
Eugene M. Chow (SM’18) received the B.S. degree in engineering physics from UC Berkeley, and the M.S. degree in engineering management and the M.S. and Ph.D. degrees in electrical engineering from Stanford University, with his Ph.D. work focusing on microsystems fabrication of through silicon electrical interconnects and atomic force cantilever arrays. He is currently a Principal Scientist and also the Manager of the Microsystems Research Group, Electronic Materials and Devices Laboratory, Palo Alto Research Center (PARC). His work focuses on microsystems technology for applications in printing for manufacturing, electronics, and biomedicine. His recent projects include micro-assembly for device integration, microsprings for electronics packaging and test, and microjets for drug delivery. He has extensive experience in leading projects sponsored by the government, Xerox, or other companies. He has filed over 100 patents. He is a Senior Member of the IEEE.
研究兴趣
论文共 72 篇作者统计合作学者相似作者
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https://doi.org/10.1117/12.2583479 (2021)
Yunda Wang,Sourobh Raychaudhuri,Jeng Ping Lu,Eugene M. Chow,Julie A. Bert, D. K. Biegelsen, George A. Gibson,Jamie Kalb
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (2020)
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Eugene M. Chow,Jeng Ping Lu,Bradley B. Rupp,Anne Plochowietz,Lara S. Crawford,Matthew Shreve,Sourobh Raychaudhuri, Sergey Butylkov,Yunda Wang,Ping Mei, Siv Kor,Qian Wang,
SID Symposium Digest of Technical Papersno. 1 (2019): 349-352
Electronic Components and Technology Conferencepp.1312-1315, (2019)
Eugene M. Chow, Christopher L. Chua
MEMS PackagingWSPC Series in Advanced Integration and Packaging (2017)
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