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Research Interests

Papers共 52 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
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合作机构
Signal & Power Integrity Optimization Utilizing Silicon Core Substrate
Seann Ayers,Steven Verhaverbeke, Han-Wen Chen,Liu Jiang,El Mehdi Bazizi
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.279-284, (2024)
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Modeling of Negative Bias Temperature Instability (NBTI) for Gate-All-Around (GAA) Stacked Nanosheet Technology
Leitao Liu, Jingtian Fang,Ashish Pal,Plamen Asenov,Mohit Bajaj, Bei Deng,Xi-Wei Lin, Souvik Mahapatra, Subi Kengeri,El Mehdi Bazizi
IEEE International Reliability Physics Symposiumpp.7B.5-1-7B.5-6, (2024)
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D2W Hybrid Bonding Challenges for HBM
Gaurav Mehta, Jonathan Abdilla,Raymond Hung,El Mehdi Bazizi, Yong Chang Bum, Djuro Bikajlevic,Liu Jiang,Gregory Costrini
International Memory Workshoppp.1-4, (2024)
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GAA Technology Innovations for 2nm Logic node and Beyond
El Mehdi Bazizi,Gregory Costrini,Ashish Pal,Pratik B. Vyas,Sefa Dag, Charisse Zhao, Priyamvada Jadaun
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
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Contact Cavity Shaping and Selective SiGe: B Low-Temperature Epitaxy Process Solution for sub 10 Ω.cm Contact Resistivity in Nonplanar FETs
N. Breil, B.-C. Lee, J. Avila Avendano, J. Jewell, M. Vellaikal, E. Newman,E. M. Bazizi, A. Pal, L. Liu,Oleg Gluschenkov,A. Greene,S. Mochizuki,
VLSI Technology and Circuitspp.1-2, (2023)
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Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond
Gaurav Thareja,Ashish Pal, Quan Ma, Chi Ching, Sahil Patel,Xingyao Gao,Sefa Dag, Zhimin Qi, Aixi Zhang, Shiyu Yue,Wei Lei,Yi Xu,
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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Materials to System Co-optimization (MSCOTM) for SRAM and its application towards Gate-All-Around Technology
Pratik B. Vyas,Ashish Pal,Gregory Costrini,Plamen Asenov, Sarra Mhedhbi, Charisse Zhao,Victor Moroz,Benjamin Colombeau,Bala Haran,El Mehdi Bazizi,Buvna Ayyagari-Sangamalli
2023 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPADpp.53-56, (2023)
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Development of Copper Thermal Coefficient For Low Temperature Hybrid Bonding
Sefa Dag, Ming Liu,Liu Jiang, Amir Kiaee, Gilbert See,Prayudi Lianto,Buvna Ayyagari-Sangamalli,El Mehdi Bazizi
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.342-349, (2023)
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Plasma Modeling Framework on Dielectric Surfaces in Hybrid Bonding Technology
Sefa Dag,Liu Jiang,Raymond Hung,Prayudi Lianto,Jinho An,Gilbert See,El Mehdi Bazizi
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.211-215, (2023)
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