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Papers共 40 篇Author StatisticsCo-AuthorSimilar Experts
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2023 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPADpp.45-48, (2023)
VLSI Technology and Circuitspp.1-2, (2023)
PHYSICAL REVIEW APPLIEDno. 4 (2023)
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)pp.237-240, (2023)
Ang-Sheng Chou,Ching-Hao Hsu,Yu-Tung Lin,Goutham Arutchelvan,Edward Chen,Terry Y.T. Hung,Chen-Feng Hsu, Sui-An Chou, Tsung-En Lee, Oreste Madia, Gerben Doornbos,Yuan-Chun Su,
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)pp.1-2, (2023)
Small (Weinheim an der Bergstrasse, Germany)no. 15 (2023): e2207394-e2207394
Smallno. 15 (2023)
Po-Hsun Ho,Ren-Hao Cheng,Po-Heng Pao, Sui-An Chou, Yi-Hsiu Huang,Yu-Ying Yang, Yu-Syuan Wu,Yuan-Chun Su,Po-Sen Mao,Sheng-Kai Su,Bo-Jhih Chou,Edward Chen,
ACS nanono. 13 (2023): 12208-12215
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