基本信息
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职业迁徙
个人简介
During the last several years, we have been inundated by a deluge of data in applications including distributed networked systems, finance, medical imaging, and seismics. My interest lies in fundamental research for problems involving vast amounts of data that must be processed effectively and rapidly in order to extract useful - potentially "actionable" - information. To approach these problems, we must use a multi-disciplinary approach, and I combine tools from information theory, statistical signal processing, machine learning, and computer science. I call this computational information processing.
Specific research directions that I have worked on include:
MDL signal estimation and universal denoising.
Compressed sensing (CS) - signal reconstruction algorithms, information theoretic results, distributed CS, hardware projects in CS, and other unrelated CS topics.
Fast algorithms for universal lossless compression.
Universality in channel coding and distributed compression.
Worst-case constraints in compression and prediction.
Compression and represenation of multi-dimensional functions with smooth discontinuities.
Delay-constrained performance in ALOHA networks.
Specific research directions that I have worked on include:
MDL signal estimation and universal denoising.
Compressed sensing (CS) - signal reconstruction algorithms, information theoretic results, distributed CS, hardware projects in CS, and other unrelated CS topics.
Fast algorithms for universal lossless compression.
Universality in channel coding and distributed compression.
Worst-case constraints in compression and prediction.
Compression and represenation of multi-dimensional functions with smooth discontinuities.
Delay-constrained performance in ALOHA networks.
研究兴趣
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2183-2187, (2023)
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2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
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PROCEEDINGS OF THE 32ND USENIX SECURITY SYMPOSIUMpp.6381-6398, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1958-1963, (2022)
2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD)pp.167-172, (2022)
arxiv(2022)
semanticscholar(2021)
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
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