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Douglas DeVoto (Member, IEEE) received the B.S. degree in mechanical engineering from the University of Delaware, Newark, DE, USA, in 2008, and the M.S. degree in mechanical engineering from the University of Maryland, College Park, MD, USA, in 2010.
He leads reliability evaluation and prognostics research for automotive power electronics, with a focus on bonded interfaces, electrical interconnects, and high-temperature packages with the Center for Integrated Mobility Sciences (CIMS), Advanced Power Electronics and Electric Machines (APEEM) Group, National Renewable Energy Laboratory (NREL), Golden, CO, USA. He has over ten years of experience in accelerated testing as well as thermal and thermomechanical FEA modeling for electric-drive vehicles and other applications. He is presently focused on developing power module concepts that utilize novel materials and manufacturing techniques to enable 250 °C operation.
Mr. Douglas is a Member of the Institute of Electrical and Electronics Engineers and American Society of Mechanical Engineers. He was a recipient of the Outstanding Paper Award (second place) at the 2013 ASME InterPACK Conference and the 2016 Research and Development 100 Award.
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IEEE TRANSACTIONS ON POWER ELECTRONICSno. 1 (2024): 507-516
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (2023)
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David E. Sanabria, Randy Appert, Steven G. E. Pronko,Joshua Major,Douglas DeVoto,Karen Heinselman,Jane M. Lehr, Nicolas Gonzalez,David S. Ginley
2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)pp.227-232, (2022)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
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2021 IEEE Applied Power Electronics Conference and Exposition (APEC)pp.20-26, (2021)
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