基本信息
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个人简介
Donald F. Canaperi received the B.A. degree in chemistry from Western Connecticut State University, Danbury, in 1983.
He joined the IBM T. J. Watson Research Center in 1983 and has been involved in process research and development for semiconductor device fabrication, interconnect technology, and chip packaging. He holds several patents in the area of chemical mechanical planarization, electroplating, and electroless metal deposition.
研究兴趣
论文共 111 篇作者统计合作学者相似作者
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Springer Handbook of Semiconductor DevicesSpringer Handbookspp.219-257, (2022)
H. Wu, V. Katragadda, E. Evarts, E. Edwards,R. Southwick,A. Dutta,G. Lauer, V. Mehta, R. Johnson,O. van der Straten,A. Reznicek, M. Wordeman,
2021 IEEE International Electron Devices Meeting (IEDM)pp.2.3.1-2.3.4, (2021)
B. Peethala,D. Sil,B. Briggs, D. Rath,N. Lanzillo, K. Matam,H. Shobha,K. Choi,T. Spooner,D. Canaperi,B. Haran, M. Packiam,
2021 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2021)
Jessica Gruss-Gifford, Virat Mehta,Oscar van der Straten, Gabriel Rodriguez, Maxwell Lippitt,Donald Canaperi
Han You, Petra Mennell, Matthew T. Shoudy,Devika Sil, Donald Dorman,S. Cohen,E. Liniger,Thomas M. Shaw, Tsong-Lin Leo,Donald F. Canaperi,Mark Raymond,Anita Madan,
ECS Meeting Abstractsno. 22 (2018): 1371-1371
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作者统计
#Papers: 102
#Citation: 2294
H-Index: 28
G-Index: 44
Sociability: 7
Diversity: 1
Activity: 0
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