基本信息
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个人简介
Dingyou Zhang received the B.S. degree in electronic engineering from Tsinghua University, Beijing, China, in 2008, and the M.S. and Ph.D. degrees in electrical engineering from Rensselaer Polytechnic Institute, Troy, NY, USA, in 2010 and 2013, respectively. Since 2013, she has been with GlobalFoundries packaging development organization, where she is currently a Principal Engineer, focusing on 3-D/TSV development for advanced technology nodes.
研究兴趣
论文共 23 篇作者统计合作学者相似作者
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期刊级别
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Materials for Advanced Packagingpp.1-26, (2016)
Handbook of 3D Integrationpp.261-278, (2014)
Dingyou Zhang, Sarasvathi Thangaraju,Daniel Smith,Himani Kamineni,Christian Klewer,Mark Scholefield, Ming Lei,Tong Qing Chen,Kumarapuram Gopalakrishnan,Abhishek Vikram, Victor Lim,Wonwoo Kim,
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2014): 001506-001522
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作者统计
#Papers: 22
#Citation: 193
H-Index: 8
G-Index: 13
Sociability: 5
Diversity: 1
Activity: 0
合作学者
合作机构
D-Core
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