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个人简介
Dinesh Maddipatla (Member, IEEE) received the B.E. degree in electrical and electronics engineering from Anna University, Chennai, India, in 2013, the M.Sc. degree in electrical engineering from Western Michigan University (WMU), Kalamazoo, MI, USA, in 2016, and the Ph.D. degree from the Electrical and Computer Engineering Department, WMU, in 2020.
He is currently working as a Research Associate with the Center for Advanced Smart Sensors and Structures (CASSS), WMU. He has authored over 100 refereed journal articles and refereed conference proceedings. In addition, he holds over 15 patents and invention disclosures. His research interests include all aspects of design, fabrication, and characterization of printed electronics focusing on flexible sensor structures, microfluidics, electrochemical sensors, gas sensors, and lab-on-a-chip sensing systems.
Dr. Maddipatla was awarded the Technology Transfer Talent Network (T3N) from the State of Michigan, the All-University Research and Creative Scholar Award, and the Dissertation Completion Fellowship from WMU. He is also serving as an Associate Editor for Frontiers in Sensors and Frontiers in Chemistry, and a reviewer for more than 20 international journals.
研究兴趣
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2023 IEEE SENSORSpp.1-4, (2023)
S. Akhmatdinov, H. Dogdu, M. Haley,M. Panahi,A. J. Hanson,S. Masihi, A. H. Adineh,V. Palaniappan,D. Maddipatla,M. Z. Atashbar
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)pp.1-4, (2023)
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)pp.1-4, (2023)
IEEE Journal on Flexible Electronicsno. 2 (2023): 92-100
2023 IEEE SENSORSpp.1-4, (2023)
Alimohammad Haji Adineh, G. Hajimazdarani,Valliammai Palaniappan,Dinesh Maddipatla, Himanaga Rama Krishn Emani,Binu B. Narakathu,Bradley J. Bazuin,Massood Z. Atashbar
International Conferences on Sensing Technologypp.1-5, (2023)
Himanaga Rama Krishna Manoj Emani, Alexander Bawilianthang, Jeremiah Tumminello, Tony Hanson,Dinesh Maddipatla,Massood Z. Atashbar
International Conferences on Sensing Technologypp.1-5, (2023)
IEEE Journal on Flexible Electronicsno. 2 (2023): 51-60
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)pp.1-4, (2023)
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)pp.1-4, (2023)
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