基本信息
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Bio
David Wei Zhang received the B.S., M.S., and Ph.D. degrees in electrical engineering from Xi’an Jiaotong University, Xi’an, China, in 1988, 1991, and 1995, respectively. He was an Associate Professor with Fudan University, Shanghai, China, in 1997, where he has been a Full Professor since 1999 and is currently the Chairman of the Department of Microelectronics and the Director of the Fudan-Novellus Interconnect Research Center.
Research Interests
Papers共 31 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Electron Device Lettersno. 99 (2024): 1-1
Shice Wei,Xuewen Xia, Shuai Bi,Shen Hu, Xuefeng Wu,Hsien-Yi Hsu,Xingli Zou,Kai Huang,David W Zhang, Qinqqing Sun,Allen J Bard,Edward T Yu,
Chemical Society reviewsno. 13 (2024): 6860-6916
Jiyuan Zhu,Shen Hu,Bojia Chen, Shice Wei,Yu Zhang, Xuefeng Wu,Xingli Zou,Xionggang Lu,Qingqing Sun,David W. Zhang,Li Ji
Qi Han,Jun Wang, Shuangshuang Tian,Shen Hu,Xuefeng Wu,Rongxu Bai,Haibin Zhao,David W. Zhang,Qingqing Sun,Li Ji
Nature Communicationsno. 1 (2024): 1-9
Jiyuan Zhu,Shen Hu,Bojia Chen, Shice Wei,Yu Zhang, Xuefeng Wu,Xingli Zou,Xionggang Lu,Qingqing Sun,David W. Zhang,Li Ji
JOURNAL OF CHEMICAL PHYSICSno. 4 (2024)
Shuming Guo,Jiajie Yu, Hao Wang, Xingcheng Jin, Hongbo Li, Chao Wu,Lin Chen,Yinyin Lin,David Wei Zhang
IEEE Transactions on Electron Devicesno. 99 (2024): 1-6
Nanoscaleno. 21 (2023): 9432-9439
2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023)
Xiangyu Guo,Qi Han,Jun Wang, Shuangshuang Tian,Rongxu Bai,Haibin Zhao,Xingli Zou,Xionggang Lu,Qingqing Sun,David W Zhang,Shen Hu,Li Ji
ACS applied materials & interfacesno. 20 (2023): 24606-24613
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