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Dr. Damian Valles is an Assistant Professor for the Ingram School of Engineering at Texas State University. He focuses on High-Performance Computing (HPC), Machine Learning (ML), and Embedded System implementations under the High-Performance Engineering (HiPE) research group. Dr. Valles received his B.S., M.S, and PhD. from The University of Texas at El Paso from the Electrical and Computer Engineering Department, focusing on Reconfigurable Processors and HPC research. Dr. Valles did a post-doc at Montana Tech as the HPC Application Scientist under the Computer Science department. He also worked as an HPC System Administrator in the Information Systems department and an adjunct position in the Computer Science department at Wake Forest University. He is currently a member of IEEE, ACM, ACM's SIGHPC, and SHPE.
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论文共 59 篇作者统计合作学者相似作者
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Evan R. Smith,Rachel M. Koldenhoven,John W. Farrell,Semih Aslan, Maria D. Resendiz,Yumeng Li,Ting Liu,Damian Valles
Computing and Communication Workshop and Conferencepp.249-256, (2024)
Faria Farzana,Damian Valles
2024 IEEE World AI IoT Congress (AIIoT)pp.8-15, (2024)
2024 IEEE World AI IoT Congress (AIIoT)pp.29-37, (2024)
Saddam Hossain,Damian Valles
2024 IEEE World AI IoT Congress (AIIoT)pp.0016-0023, (2024)
Gavin Jackson,Damian Valles
2024 IEEE World AI IoT Congress (AIIoT)pp.0045-0051, (2024)
Saad A. Rafiq, Erich S. Ellsworth, Oscar Resendiz, Susmitha H. Varanasi, Adenrele A. Ishola, Rachel Koldenhoven, John W. Farrell, Yumeng Li, Maria D. Resendiz, Semih Aslan, Ting Liu,Damian Valles
2024 IEEE World AI IoT Congress (AIIoT)pp.421-428, (2024)
2023 IEEE 13th Annual Computing and Communication Workshop and Conference (CCWC)pp.0382-0388, (2023)
Sabhasachi Saha,Damian Valles
2023 IEEE 13th Annual Computing and Communication Workshop and Conference (CCWC)pp.553-558, (2023)
JOURNAL OF SPORT & EXERCISE PSYCHOLOGY (2023): S19-S19
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Damian Valles, Lois Adrianne R. Umali,Thomas Paveglio, Josiah N. Brinson, Mohammed Hyder, Gavin E. Jackson, Dylan Hall,John W. Farrell,Yumeng Li, Semih Aslan, Maria D. Resendiz, Ting Liu
AIIoTpp.669-677, (2023)
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